Though not exhibiting this year, Nexteck continues to support the semiconductor community with high-performance Cover Tape and UV Dicing Tape designed for precision packaging and wafer processing.
Our materials are widely used in ICs, MEMS, power devices, and optoelectronics, helping customers achieve higher stability and yield.
✔ Cover Tape for high-speed automation
✔ UV Dicing Tape with excellent thermal resistance and stable adhesion
📌 Visit our website to explore more about our advanced material solutions.
🌐 Learn more:
Nexteck — Empowering the future of semiconductor packaging materials
